Originally Aired - Tuesday, October 8 • 1:30 PM - 3:00 PM Central Time
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Location: New Orleans Convention Center, Room 240
Title: Treatment Challenges and Reuse within the Semiconductor Industry
Description:
Our speakers will dive into the challenges faced by the semiconductor industry in treating high-strength wastewaters which include TDS, TOC, various inorganics, etc. and lead to the formation of disinfection byproducts (bromoform). Various treatment methods and disinfection alternatives will be discussed. Options for Zero-Liquid Discharge (ZLD) will also be explored to promote water reuse/reclamation within the semiconductor fabrication process which will help lead to net positive water.
Learning Objectives
Interactive Session | Facilitated Discussion
At the end of this session, participants will be able to:
1. Recognize the formation as well as mitigation of disinfection byproducts in semiconductor wastewater discharge.
2. Explore ideas for water conservation and reuse/reclamation, including Zero Liquid Discharge (ZLD), within the semiconductor industry which requires a significant demand of high purity water and produces a challenging-to-treat waste stream.
3. Discuss using vacuum-ultraviolet (VUV) oxidation and flow-electrode capacitive deionization (FCDI) to degrade TOC and TDS in high-strength wastewaters generated in the semiconductor fabrication process (using synthetic wastewater).
PRESENTATIONS
End-of-Pipe Zero Liquid Discharge Coupled with Ultrapure Water Recycling: Building Critical Resilience in the Semiconductor Industry
1:30 PM - 1:50 PM
Facilitated Discussion: End-of-Pipe Zero Liquid Discharge Coupled with Ultrapure Water Recycling
1:50 PM - 2:00 PM
Managing Unintended Consequences: Mitigating Disinfection Byproduct Formation Via Modified Disinfection Chemistry
2:00 PM - 2:20 PM
Facilitated Discussion: Managing Unintended Consequences
2:20 PM - 2:30 PM
Presentation TBD
2:30 PM - 2:50 PM
Facilitated Discussion
2:50 PM - 3:00 PM
Type: Interactive Technical Session
